1 北京航空航天大学机械工程及自动化学院，北京 100191
2 清华大学机械工程学院摩擦学国家重点实验室，北京 100084
集成电路(IC)芯片封装中小尺寸、细节距焊点采用的传统锡基钎料在服役过程中存在桥接、电迁移、金属间化合物等问题，在大电流、大功率密度的应用中受到限制。采用脉冲激光沉积 (PLD)技术，在覆铜陶瓷 (DBC) 基板上图形化沉积了多孔微米银焊点，用于替代传统的钎料凸点，并将其应用于Si芯片与DBC基板的连接。结果表明：采用不锈钢作为掩模，可沉积出500 μm及300 μm特征尺寸的疏松多孔银焊点阵列，银焊点呈圆台形貌；在250 ℃温度、2 MPa压力下热压烧结10 min，Si芯片与DBC基板连接良好，连接后的银焊点边缘的孔隙率为42%左右，银焊点中心区域的孔隙率为22%; 500 μm和300 μm特征尺寸的银焊点的连接接头的剪切强度分别为14 MPa和12 MPa；接头断裂主要发生在银焊点与芯片或DBC基板的连接界面处。
激光技术 脉冲激光沉积 图形化连接 多孔微米银焊点 热压烧结 剪切强度
Author Affiliations
Abstract
Key Laboratory of Radar Imaging and Microwave Photonics, Ministry of Education, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
Optoelectronic components and subsystems such as optically controlled phased array antennas, distributed radar networks, interferometric optical fiber hydrophones, and high-speed optoelectronic chips demand high-accuracy optical time delay measurement with large measurement range and the capability for single-end and wavelength-dependent measurement. In this paper, the recent advances in the optical time delay measurement of a fiber link with high accuracy are reviewed. The general models of the typical time delay measurement technologies are established with the operational principle analyzed. The performance of these techniques is also discussed.
060.2300 Fiber measurements 120.5050 Phase measurement 280.3400 Laser range finder Chinese Optics Letters
2019, 17(6): 060601
